EPICLON® for Printed Circuit Boards

Industry-leading epoxy resins for heat-resistant semiconductor packaging assemblies.

DIC’s EPICLON® epoxy resins are developed for semiconductor packaging assemblies that demand excellent heat resistance and low thermal expansion. Available in imidazole- and phenolic novloac-curable varieties, EPICLON® epoxy resins feature high density functional groups and high solubility for general-purpose solvents.

Key attributes & features:

  • Industry-leading heat resistance
  • Low thermal expansion
  • Outstanding solder resistance
  • Dissolves in general-purpose solvents such as MEK and cyclohexanone

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