Tokyo Pack 2018
DIC will participate in the Tokyo International Packaging Exhibition 2018 (Tokyo Pack 2018). The exhibition will be held on October 2nd to 5th 2018. This year, the DIC’s exhibition theme is “sustainability”.
This time, the DIC’s booth exhibits the innovative solution based on the demands of social issues and customer’s needs, not to mention our principal technologies of ink, adhesive, film and color. We hope for all visitors to discover business hints through our exhibitions.
To learn more about DIC’s solutions on display during Tokyo Pack 2018, visit booth 1-57 at Tokyo Big Sight in Tokyo on October 2-5, 2018
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