Control Fluid Degasification and Aeration in Semiconductor Microchip Processing Using SEPAREL® Hollow-Fiber Membrane Degassing Modules

SEPAREL® membrane degassing technology can be used in a wide range of applications in the front-end processes of semiconductor chip processing. Providing excellent degassing for plating solutions, photoresist immersion lithography, etching, and developing solution.

SEPAREL® membrane degassing technology is manufactured to semiconductor standards at DIC Corporation’s facility in Chiba, Japan.  All products are tested and inspected as required by semiconductor standards.

Major Applications

• Wafer cleaning; aeration for functional water production
• Deposition process; degassing plating solutions
• Photoresist coating; Degassing photoresist
• Exposure; degassing immersion liquid
• Development; degassing developer solution
• Etching; degassing etching solution